Creep Transient Based On Material Selection
Different materials have different properties and hence creep varies from material to material. It occurs for tungsten, which has a very high melting point, at very high temperatures (1370 C) while for solder, lead etc. which have very low melting points it occurs at room temperature. Also the since the creep curve depends on various factors like obstacle density, strength etc. it varies widely for different types of materials like ceramics, polymers and metals. Higher the strength of a material more is the resistance it offers to creep deformation. For brittle materials which generally do not show a plastic region the creep deformation behavior will be much different from ductile materials. You may check out the links provided in the right column for a comparison of creep behavior in different type of metals.
The experiment has been carried out using Monte Carlo Simulation in which dynamic variables are updated at each time interval with random numbers to study the microscopic and dynamic behavior of various systems. Here each element is characterized by strength parameter 's' and slip probability. The concept of load shedding i.e. transfer of load to neighboring sites when slip occurs is considered.
The model assumes that strain hardening and recovery processes can be ignored for small strain regime and materials with low hardening rates, that obstacle density and its behavior does not change during the deformation process and that materials respond to plastic deformation in the same way because the observed behavior is due to a large number of discrete events coupled through load transfer.